Adhesion enhanced semiconductor die for mold compound packaging

ABSTRACT

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.

CROSS REFERENCE TO RELATED APPLICATION:

This application is a continuation of application Ser. No. 08/963,395,filed Nov. 3, 1997, now Pat. No. 6,066,514, issued May 23, 2000, whichis a divisional of application Ser. No. 08/731,793, filed Oct. 18, 1996,now U.S. Pat. No. 5,760,468, issued Jun. 2, 1998, which is acontinuation of application Ser. No. 08/306,024, filed Sep. 14, 1994,now U.S. Pat. No. 5,583,372, issued Dec. 10, 1996.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates in general to a semiconductor die packagingtechnique and, more particularly, to a die having a metal layer backside for enhanced adhesion of the die in a Leads On Chip (LOC) packagesystem.

2. State of the Art

A semiconductor integrated circuit (IC) packaged device generallyincludes an IC chip (die) being connected to inner leads of a lead frameby wire bonds. The chip, wire bonds, and inner leads are completelyencapsulated (packaged) for protection with a substance, such asplastic. Outer leads communicate with the inner leads of the lead frame,but the outer leads typically remain exposed for mounting of thepackaged device to external circuitry, such as a printed circuit board.Conventionally, encapsulation occurs by a transfer molding techniquewherein the encapsulation substance is a thermoses epoxy molded aroundand to the die and lead frame and subsequently cured.

In a conventional IC packaged device, a semiconductor die is placed onand bonded to a center die paddle of a lead frame for support. Innerlead fingers of the lead frame approach the paddle but do not contact orcommunicate with the paddle. Rather, wire bonds communicate betweencontact pads on the die and the inner lead fingers of the lead frame byspanning the gap between the die and the fingers. The wire bonds allowfor the transmission of the electrical signals to and from the die andthe lead frame.

However, to shrink the conventional packaging requirements, techniquessuch as the Lead On Chip (LOC) method have been developed. The LOCtechnique disposes the inner lead fingers of a lead frame directly overthe die (or IC chip) rather than away from the die. Double-sidedadhesive insulating tape attaches the conductive lead fingers to the dieso that no gap exists between the die and lead fingers. Wire bondscommunicate between the contact pads on the die and the inner leadfingers which are disposed over the insulating tape directly over aportion of the die adjacent the die pads.

This LOC technique allows the entire packaging of the IC device to besmaller because the inner lead fingers are disposed directly over thedie rather than separate from the die. Similar to LOC, other variationsof using an adhesive tape for adhering lead fingers and, consequently,shrinking packaging requirements include a Tape Under Frame techniqueand a Leads Under Die method.

Although IC packaging is minimized in each of these packaging techniquesthat uses an adhesive tape, other problems surface. One such problem inthe LOC technique is the difficulty of obtaining a good, solid adhesivebond between the die and the package. One reason a solid bond is notachieved is because the oxide on the silicon die substrate does not lenditself to uniform wetting, which is necessary for good adhesion with theliquid mold compound.

When a die does not bond well with the mold compound package,delamination may occur and the device may potentially be ruined duringthe manufacturing process or surface mount of the package. Sinceproduction environment areas retain a substantial humidity level toreduce static buildup, i.e., often about 50%, moisture absorbs into themold compound and can penetrate delaminated areas between the die andmold compound. When the moisture is converted to steam from heatprocesses and the steam pressure is greater than the strength of theadhesion couple between the mold compound and the die, the mold compoundwill crack or explode with a “popcorn” effect.

To overcome this potential package cracking problem, one technique hasbeen to bake the moisture out of the mold compound to ensure a lowmoisture content within the package. Another step is to place the devicein a “dry package” for shipping purposes by placing the finalsemiconductor chip product in a shipping container with a desiccantdrying agent, such as silica gel. Although these techniques are commonlyused in the semiconductor industry, they provide only a temporarysolution. Namely, when a semiconductor manufacturer ships a “dried”packaged device by following these techniques, the device may stillabsorb moisture at a customer's s site after the device is removed fromthe shipping container materials. Furthermore, if the die hasdelaminated even slightly, the package is subject to moisturepenetration again and the package may subsequently crack if exposed tosufficient heat.

Another technique for reducing delamination potential is disclosed inU.S. Pat. No. 5,227,661 issued to Heinen on Jul. 13, 1993. Although thismethod provides a working solution, it retains disadvantages by its useof aminopropyltriethox-silane as a coating on the die.

Obviously, the foregoing problems and solutions associated withproviding a good bond between a die and a die package to avoiddelamination and cracking of the package are undesirable aspects ofconventional semiconductor packaging techniques. Accordingly, objects ofthe present invention are to provide an improved bonding between asemiconductor die and its encapsulating package in order to decreasedelamination potential of the die from the package.

SUMMARY OF THE INVENTION

According to principles of the present invention in its preferredembodiment, a back side of a semiconductor die includes a metal layerdeposited thereon for enhancing adhesion between the die and a moldcompound package. The metal layer is substantially oxide free. The dieis coated with a layer or layers of copper (Cu) and/or palladium (Pd) byelectroplating or electroless coating techniques.

According to further principles of the present invention, the metallayer preferably comprises approximately 50 micro inches of a Cu layerdeposited over the back side of the die and approximately 2 to 3 microinches of a Pd layer deposited over the Cu layer.

Advantageously, the metal layer on the die provides a uniform wettingsurface for better adhesion of the die with the mold compound duringencapsulation. The increased adhesion reduces delamination potential ofthe die from the package and, consequently, reduces cracking of thepackage.

The aforementioned principles of the present invention provide anadhesion enhanced semiconductor die for improving adhesion of the diewith a mold compound packaging. Other objects, advantages, andcapabilities of the present invention will become more apparent as thedescription proceeds.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is an end-section view of a packaged integrated circuit diehaving the present invention adhesion enhanced layer deposited thereon;

FIG. 2 is an enlarged partial view of FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is an end-section view of packaged integrated circuit (IC) 10.Lead frame 15 is disposed over IC die 20, the lead frame including innerand outer lead finger portions 25 and 30, respectively. Inner leadfingers 25 are adjacent die pads 35, and outer lead fingers 30 extendoutward of mold compound packaging 40 for connection with appropriateexternal circuitry.

Insulator adhesive tape strips 45 are disposed between inner leadfingers 25 and frontside 50 of die 20 to adhere the lead fingers to thedie. Integrated circuitry is disposed on frontside 50 of die 20. Wirebonds 52 communicate between inner lead fingers 25 and die pads 35 formaking the electrical connection between the die and the lead fingers.

Metal layer 55 is shown deposited over back side 60 of die 20. Metallayer 55 enhances adhesion of die 20 with mold compound 40. Metal layer55 is deposited over die 20 using an electroplating process orelectroless coating process well known in the art prior to packaging ofthe die with mold compound 40.

Metal layer 55 provides a uniform wetting surface for mold compound 40to adhere better to die 20. Although shown in its hardened and curedstate, mold compound 40 is in a flowing state when it is initiallyheated over and molded around die 20. Consequently, the uniform wettingsurface provided by layer 55 enhances the adhesion between the die andthe mold compound.

In its preferred embodiment, metal layer 55 is substantially oxide free.Also, preferably, the metal layer is either palladium (Pd) or copper(Cu), or a combination thereof, although it is obvious other metals maylikewise suffice. Although copper is cheaper in cost, it retains moreoxide which counteracts the intended adhesion. Palladium is moreexpensive, but provides a substantially oxide-free layer foreffectuating a good bond with the mold compound.

Although a single metal layer suffices to provide the advantages of thepresent invention, in its preferred embodiment, metal layer 55 actuallycomprises a plurality of layers as shown in FIG. 2. Namely, a cheaper,thicker layer 65 of copper deposited over back side 60 of die 20provides a good barrier to the oxide on die 20. A thinner layer 70 ofpalladium is deposited over the copper layer to provide an even betteruniform wetting surface. The palladium is also substantially free fromoxide. Preferably, about 50 micro inches of copper and approximately 2to 3 micro inches of palladium are deposited. Consequently, thiscombination of metal layers provides the enhanced adhesion layer 55 ondie 20 and, together, provide a good balance of cost and effectiveness.

As previously mentioned, when a die does not bond well with the moldcompound package, delamination may occur and the device may potentiallybe ruined during the manufacturing process or surface mount of thepackage because of moisture penetration between the die and compound.When the moisture is converted to steam from heat processes and thesteam pressure is greater than the strength of the adhesion couplebetween the mold compound and the die, the mold compound will crack orexplode with a “popcorn” effect.

The present invention, as described and diagramed, reduces thispotential package cracking problem. Consequently, no baking of themoisture out of the mold compound is needed, and no “dry packaging” thedevice for shipping purposes is needed.

What has been described above are the preferred embodiments for asemiconductor die having a metal layer back side for enhancing adhesionbetween the die and its mold compound packaging. It is clear that thepresent invention provides a powerful tool for reducing delaminationpotential of a die and subsequent cracking of the mold compoundpackaging. While the present invention has been described by referenceto specific embodiments, it will be apparent that other alternativeembodiments and methods of implementation or modification may beemployed without departing from the true spirit and scope of theinvention.

What is claimed is:
 1. A method for enhancing adhesion of asemiconductor die to a mold compound, comprising: placing a layercomprising at least one substantially oxide-free metal on at least aportion of a back surface of a die so as to intimately overlie said atleast a portion; and applying the mold compound to directly overlie saidat least a portion of said back surface of said die bearing said layersaid at least one substantially oxide-free metal enhancing adhesion ofthe mold compound to said at least a portion.
 2. The method of claim 1,wherein said placing comprises electroplating.
 3. The method of claim 1,wherein said placing comprises electroless coating.
 4. The method ofclaim 1, wherein said placing comprises depositing a plurality of metalson said at least a portion, at least the last deposited of whichcomprises a substantially oxide-free metal.
 5. The method of claim 1,further including selecting said at least one substantially oxide-freemetal from the group comprising palladium and copper.
 6. The method ofclaim 1, wherein said placing said layer comprises disposing said layerover an entirety of the back surface of said die.
 7. The method of claim6, wherein said applying is effected over the back surface bearing saidat least one substantially oxide-free metal layer.
 8. A method forenhancing adhesion of a mold compound to a semiconductor die,comprising: depositing at least one substantially oxide-free metal tooverlie and intimately contact at least a portion of a back surface of adie; and covering said at least a portion of said back surface of saiddie with the mold compound, said at least one substantially oxide-freemetal providing a wetting surface for the mold compound over said atleast a portion.
 9. The method of claim 8, wherein said depositingcomprises electroplating.
 10. The method of claim 8, wherein saiddepositing comprises electroless coating.
 11. The method of claim 8,wherein said depositing comprises depositing a plurality of metals, atleast the last of which comprises a substantially oxide-free metal. 12.The method of claim 8, further including selecting said at least onesubstantially oxide-free metal from palladium and copper.
 13. A methodfor enhancing adhesion of a mold compound to a semiconductor die,comprising: forming a layer comprising at least one substantiallyoxide-free metal to overlie at least a portion of a back surface of adie, said layer intimately contacting said at least a portion of saidback surface and providing a wetting surface to enhance adhesion of themold compound to said at least a portion of said back surface; andadhering the mold compound to said at least one substantially oxide-freemetal.
 14. The method of claim 13, wherein said forming compriseselectroplating.
 15. The method of claim 13, wherein said formingcomprises electroless coating.
 16. The method of claim 13, wherein saidforming comprises depositing a plurality of metals, at least the last ofwhich comprises a substantially oxide-free metal.
 17. The method ofclaim 13, further including selecting said at least one substantiallyoxide-free metal from palladium and copper.
 18. The method of claim 13,wherein said adhering comprises covering said at least a portion of saidback surface of said die with said mold compound.